The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 05, 2007
Filed:
Oct. 26, 2004
Yuichi Goto, Austin, TX (US);
Eiichi Hosomi, Austin, TX (US);
Yuichi Goto, Austin, TX (US);
Eiichi Hosomi, Austin, TX (US);
Kabushiki Kaisha Toshiba, Tokyo, JP;
Abstract
Systems and methods for substrate layers used in attaching devices to a semiconductor package are disclosed. A novel pad structure may be employed on a substrate layer which has pads, each pad having a common electrical potential. Multiple pad openings may be employed on a single pad, allowing the attachment of multiple terminals of one or more decoupling capacitors to a single pad. These pads and pad openings can be arranged according to the type of decoupling capacitor employed, allowing a greater total pad area to be utilized in conjunction with a set of pad openings, while simultaneously allowing the multiple pad openings on the pad to be placed closer together, reducing the ESL and ESR of the path between the semiconductor and the decoupling capacitors, increasing the mechanical reliability of the semiconductor package and allowing a higher density of decoupling capacitors to be coupled to a given area.