The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 05, 2007
Filed:
Aug. 11, 2005
Mark Pavier, Felbridge, GB;
Ajit Dubhashi, Redondo Beach, CA (US);
Norman G. Connah, Glossop, GB;
Jorge Cerezo, Palos Verdes Peninsula, CA (US);
Mark Pavier, Felbridge, GB;
Ajit Dubhashi, Redondo Beach, CA (US);
Norman G. Connah, Glossop, GB;
Jorge Cerezo, Palos Verdes Peninsula, CA (US);
International Rectifier Corporation, El Segundo, CA (US);
Abstract
A semiconductor package that includes two power semiconductor dies, such as power MOSFET dies, including vertical conduction MOSFETs, arranged in a half-bridge configuration is disclosed. The package may be mounted on a split conductive pad including two isolated die pads, each die pad being electrically connected to the second power electrode of the die that is on it. The split pad may include several conductive leads, including at least one output lead electrically connected to a first electrode of the first semiconductor die on the same side of the die as the control electrode and to the second electrode of the second die located on the opposite side of the second die from the control electrode.