The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 05, 2007
Filed:
May. 27, 2003
Applicants:
Masamichi Sudo, Tokyo, JP;
Morihiro Sudo, Tokyo, JP;
Kouichi Asai, Tokyo, JP;
Inventors:
Assignee:
Daikyo Seiko, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 43/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
A molding die assembly includes an upper die and a lower die, wherein at least one of the upper and lower dies is provided with a cavity corresponding to the shape of a rubber member to be molded, wherein at least one of the upper and lower dies is provided with an annular projection around a cavity. The distance between the upper and lower dies at the annular projection is made smaller than the distance between the opposed surface portions, other than the cavity, of the upper and lower dies. A rubber member produced by the above mentioned molding die assembly is also provided.