The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 29, 2007
Filed:
Jun. 18, 2004
Karl Klaus Dittus, Durham, NC (US);
Timothy Samuel Farrow, Apex, NC (US);
Walter Adrian Goodman, Raleigh, NC (US);
Dean Frederick Herring, Youngsville, NC (US);
William Fred Martin-otto, Apex, NC (US);
Rodrigo Samper, Raleigh, NC (US);
John Paul Scavuzzo, Rougemont, NC (US);
Karl Klaus Dittus, Durham, NC (US);
Timothy Samuel Farrow, Apex, NC (US);
Walter Adrian Goodman, Raleigh, NC (US);
Dean Frederick Herring, Youngsville, NC (US);
William Fred Martin-Otto, Apex, NC (US);
Rodrigo Samper, Raleigh, NC (US);
John Paul Scavuzzo, Rougemont, NC (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A chip sandwich includes a heat sink, a retention module, a computer chip mounted in a socket on a mother board, a wave washer spring and a mounting plate. The heat sink is mounted on the retention module using cams, hooks and heat sink tabs to provide an initial orientation of the heat sink over the computer chip. To provide final contact pressure between the heat sink and the computer chip, a wave washer spring oriented beneath the computer chip and under the mother board provides an upward pressure against the bottom of the mother board, and particularly against the center of the computer chip. Thus, by the wave washer spring pushing against the center of the computer chip, secure contact pressure is provided between the heat sink and the computer chip, while minimizing the amount of pressure between the computer chip's pins and the chip socket.