The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 29, 2007
Filed:
Aug. 24, 2004
Toshimichi Naruse, Gunma, JP;
Yoshihiro Kogure, Gunma, JP;
Takayuki Hasegawa, Gunma, JP;
Hajime Kobayashi, Saitama, JP;
Toshimichi Naruse, Gunma, JP;
Yoshihiro Kogure, Gunma, JP;
Takayuki Hasegawa, Gunma, JP;
Hajime Kobayashi, Saitama, JP;
Sanyo Electric Co., Ltd., Osaka, JP;
Abstract
A circuit device is provided in which the bonding reliability of a brazing material such as soft solder is improved. A circuit device of the present invention includes conductive patterns, a bonding material which fixes circuit elements to the conductive patterns, and sealing resin which covers the circuit elements. The circuit device has a structure in which Pb-free solder containing Bi is used as the bonding material. Since the melting temperature of Bi is high in comparison with that of a general solder, the melting of the bonding material is suppressed when the circuit device is mounted. Further, Ag or the like may be mixed into the bonding material in order to enhance the wettability of the bonding material.