The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 29, 2007
Filed:
Jul. 30, 2003
Korekazu Mochida, Legal Representative, Shizuoka, JP;
Kyoko Mochida, Legal Representative, Shizuoka, JP;
Hiroto Inoue, Hirakata, JP;
Suguru Nakao, Itami, JP;
Yukihiro Iwata, Ibaragi, JP;
Akira Takamori, Suita, JP;
Hideto Adachi, Oakayama, JP;
Masatoshi Tamura, Takatsuki, JP;
Korekazu Mochida, legal representative, Shizuoka, JP;
Kyoko Mochida, legal representative, Shizuoka, JP;
Hiroto Inoue, Hirakata, JP;
Suguru Nakao, Itami, JP;
Yukihiro Iwata, Ibaragi, JP;
Akira Takamori, Suita, JP;
Hideto Adachi, Oakayama, JP;
Masatoshi Tamura, Takatsuki, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
A method of mounting a semiconductor laser component capable of preventing deterioration of laser characteristics and destruction of the semiconductor laser component due to a rise in temperature and a residual stress of the semiconductor laser component. The semiconductor laser component is mounted on a submount by heating and pressure-bonding, and is heated again up to a temperature more than a melting point of a bonding member at the released pressure to release the residual stress.