The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 22, 2007
Filed:
Oct. 03, 2000
Noriaki Sakamoto, Gunma, JP;
Yoshiyuki Kobayashi, Gunma, JP;
Junji Sakamoto, Gunma, JP;
Shigeaki Mashimo, Gunma, JP;
Katsumi Okawa, Gunma, JP;
Eiju Maehara, Gunma, JP;
Kouji Takahashi, Gunma, JP;
Noriaki Sakamoto, Gunma, JP;
Yoshiyuki Kobayashi, Gunma, JP;
Junji Sakamoto, Gunma, JP;
Shigeaki Mashimo, Gunma, JP;
Katsumi Okawa, Gunma, JP;
Eiju Maehara, Gunma, JP;
Kouji Takahashi, Gunma, JP;
Sanyo Electric Co., Ltd., Osaka, JP;
Abstract
In the present invention there is formed a sheet-like board memberhaving conductive coating films, such as first padsand die pads, formed thereon or a sheet-like board memberwhich has been half-etched by using conductive coating films such as first padsand die pads. A hybrid IC can be manufactured by means of utilization of post-processing processes of a semiconductor manufacturer. Further, a hybrid IC can be manufactured without adoption of a support board, and hence there can be manufactured a hybrid IC which is of lower profile and has superior heat dissipation characteristics.