The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 22, 2007
Filed:
Oct. 23, 2003
Satoru Kobayashi, Komagane, JP;
Kazuyuki Kato, Nagano, JP;
Masahiro Sugiura, Matsuyama, JP;
Saburo Okabe, Tokyo, JP;
Satoru Kobayashi, Komagane, JP;
Kazuyuki Kato, Nagano, JP;
Masahiro Sugiura, Matsuyama, JP;
Saburo Okabe, Tokyo, JP;
Koa Kabushiki Kaisha, Ina-shi, JP;
Soldercoat Co., Ltd., Nagoya, JP;
Okabe Giken Co., Ltd., Shinagawa-ku, JP;
Abstract
A solder not containing lead (a lead-free solder) contains zinc and tin, and also contains 5 weight percent or less nickel and 0.5 weight percent or less aluminum with a liquid phase temperature of 260 degrees C. or greater. In addition, a lead-free solder has a liquid phase temperature of 260 degrees C. or greater, and contains 30 to 70 weight percent zinc, 5 weight percent or less nickel, and the remaining weight percent tin. Moreover, a joint is manufactured using these lead-free solders. As a result, a lead-free solder and a lead-free joint having excellent electrical characteristics but not including harmful substances, can be provided.