The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 22, 2007
Filed:
Jul. 16, 2004
Thomas E. Dueber, Wilmington, DE (US);
Michael W. West, Wilmington, DE (US);
Brian C. Auman, Pickerington, OH (US);
Robert V. Kasowski, West Chester, PA (US);
Thomas E. Dueber, Wilmington, DE (US);
Michael W. West, Wilmington, DE (US);
Brian C. Auman, Pickerington, OH (US);
Robert V. Kasowski, West Chester, PA (US);
E. I. du Pont de Nemours and Company, Wilmington, DE (US);
Abstract
The low modulus polyimide adhesive compositions of the present invention contain a low modulus polyimidosiloxane polymer, a thermosetting substantially-non-halogenated epoxy (optionally including an epoxy catalyst), a plasticizer, an insoluble halogen-free flame-retardant filler, and optionally an adhesion promoter. The adhesive can be applied upon (or incorporated into) flexible circuits using a relatively low lamination temperature, generally no higher than 200, 190, 180, 175, 170, 165, 160, 155, or 150° C. The adhesive is generally resistant to unwanted curl even in cases where the adhesive polyimide and the base film polyimide have a coefficient of linear thermal expansions (measured between 50° C. and 250° C.) that differ by more than 10, 15, 20 25, or 30 ppm/° C.