The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 22, 2007

Filed:

Jun. 20, 2001
Applicants:

Takanori Anazawa, Sakura, JP;

Atsushi Teramae, Yachimata, JP;

Inventors:

Takanori Anazawa, Sakura, JP;

Atsushi Teramae, Yachimata, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B44C 1/17 (2006.01); B31B 1/60 (2006.01); B29C 65/00 (2006.01); B32B 37/00 (2006.01); B01L 3/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention provides a method of manufacturing a microdevice having a fine capillary cavity formed as a cut portion of a very thin layer which is likely to be broken, particularly a method of manufacturing a microdevice having complicated passages formed in three dimensions with high productivity. Also, the present invention provides a multi-functional microdevice which has a fine capillary passage formed by laminating plural resin layers, fine capillary cavities piercing through the respective layers to communicate and intersect three-dimensionally with each other, a space which should serve as a reaction chamber, a diaphragm valve, and a stopper structure. The method includes the steps of forming a semi-cured coating film having a cut portion made of an active energy ray curable composition on a coating substrate, laminating the semi-cured coating film with another member and removing the substrate, irradiating the semi-cured coating film again with an active energy ray before and/or after the removal of the substrate, thereby curing the coating film and bonding with said another member. The microdevice has a multi-layered structure wherein a member (J') {selected from a member having a cut portion piercing through the member, a member having a recessed cut portion on the surface, and a member having a cut portion piercing through the member and a recessed cut portion on the surface}, a member (K′) and one or more active energy ray curable resin layers (X′) having a cut portion at a portion of the layer, the cut portion having a minimum width within a range from 1 to 1000 μm, are laminated and two or more cut portions in the members are connected to form a cavity.


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