The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 22, 2007
Filed:
Apr. 15, 2003
Yasumi Sago, Tokyo, JP;
Kazuaki Kaneko, Tokyo, JP;
Takuji Okada, Tokyo, JP;
Masayoshi Ikeda, Tokyo, JP;
Toshihiro Tachikawa, Isehara, JP;
Tadashi Inokuchi, Isehara, JP;
Takashi Kayamoto, Isehara, JP;
Yasumi Sago, Tokyo, JP;
Kazuaki Kaneko, Tokyo, JP;
Takuji Okada, Tokyo, JP;
Masayoshi Ikeda, Tokyo, JP;
Toshihiro Tachikawa, Isehara, JP;
Tadashi Inokuchi, Isehara, JP;
Takashi Kayamoto, Isehara, JP;
Canon Anelva Corporation, Tokyo, JP;
Abstract
This application discloses the structure of an ESC stage where a chucking electrode is sandwiched by a moderation layer and a covering layer. The moderation layer and the covering layer have the thermal expansion coefficients between the dielectric plate and the chucking electrode. This application also discloses the structure of an ESC stage where a chucking electrode is sandwiched by a moderation layer and a covering layer, which have internal stress directed oppositely to that of the chucking electrode. This application further discloses a substrate processing apparatus for carrying out a process onto a substrate as the substrate is maintained at a temperature higher than room temperature, comprising the electrostatic chucking stage for holding the substrate during the process.