The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 22, 2007

Filed:

Sep. 12, 2006
Applicants:

Michael G. Pecht, Hyattsville, MD (US);

Joseph A. Swift, Ontario, NY (US);

Stanley J. Wallace, Victor, NY (US);

Yuliang Deng, Greenbelt, MD (US);

Inventors:

Michael G. Pecht, Hyattsville, MD (US);

Joseph A. Swift, Ontario, NY (US);

Stanley J. Wallace, Victor, NY (US);

Yuliang Deng, Greenbelt, MD (US);

Assignee:

Xerox Corporation, Stamford, CT (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/00 (2006.01); H05K 1/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

According to various embodiments, exemplary interconnects and methods for interconnection are provided that can include contacts formed by fiber bundles. The exemplary interconnects can be used to form separable or non-separable electro-mechanical connections between one or more of the generally accepted six levels of interconnection. In various embodiments, the exemplary interconnects can allow management of the thermal properties of the electronic devices. Exemplary interconnects can also provided reduced thickness allowing redundancy and additional compliance as desired.


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