The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 22, 2007
Filed:
Jul. 12, 2005
Masaaki Tanaka, Kariya, JP;
Tiaki Mizuno, Toyota, JP;
Hiromi Ariyoshi, Kariya, JP;
Denso Corporation, Kariya, JP;
Abstract
In a thermal-type flow rate sensor, a mold material is formed to integrally cover a predetermined range including a circuit chip, connecting parts of connecting wires with a flow rate detecting chip and the circuit chip, and connecting parts of connecting wires with the circuit chip and a lead portion, to expose a part of the flow rate detecting chip to a measured fluid. The flow rate detecting chip is located in a groove portion of a support member to have a clearance with the groove portion and to form a cavity part inside a thin wall portion of the detecting chip. The cavity part communicates with an outside through a communicating portion that includes the clearance, and the clearance is blocked by a filler at least at a portion positioned in the predetermined range. Therefore, the filler prevents the mold material from entering the clearance in the mold forming.