The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 15, 2007
Filed:
Feb. 25, 2003
Shiro Yamashita, Fujisawa, JP;
Masahide Harada, Yokohama, JP;
Kenichi Yamamoto, Kodaira, JP;
Munehiro Yamada, Hachioji, JP;
Ryosuke Kimoto, Hamura, JP;
Shiro Yamashita, Fujisawa, JP;
Masahide Harada, Yokohama, JP;
Kenichi Yamamoto, Kodaira, JP;
Munehiro Yamada, Hachioji, JP;
Ryosuke Kimoto, Hamura, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
Solder is connected to the electrodes of the circuit board by using a temperature profile with a constant fusion temperature, a connection interface strength evaluation test is carried out on the soldered joints to obtain an appropriate reflow range free of decreases in the strength at the connection interface. On the basis of the appropriate reflow range obtained and using as the basis the chemical compound thickness which is determined uniquely by heat load, an appropriate reflow range in an optional temperature profile with one temperature peak is obtained. By carrying out connection in this appropriate reflow range, soldered joints can be obtained without decreases in the connection interface strength in the large-scale production stage.