The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 08, 2007

Filed:

Feb. 13, 2004
Applicants:

Takahiro Yaguchi, Kanagawa, JP;

Seishi Eya, Kanagawa, JP;

Inventors:

Takahiro Yaguchi, Kanagawa, JP;

Seishi Eya, Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 17/50 (2006.01);
U.S. Cl.
CPC ...
Abstract

A device for estimating the required number of board layer to provide necessary wiring in a printed circuit board or a LSI package, a system including the device, a method and a program for estimating the same. In this system, positional information of pins mounted to each component and a board, and connection information between pins are retrieved from a pin positional information file and a net list file. Further, information about an order of layers to be added, a diameter of a via in respective layers and obstacles to wiring is retrieved from the net list file an added layer structure defining file. Thereafter, information about a layer structure, vias, an area where wiring is prohibited is stored in a storage. A wiring route searching section determines whether or not it is possible to form necessary wiring under the present structure. When the wiring route searching section determines it to be impossible, a layer in the next order is added according to information about added layers. Subsequently, the wiring route searching section judges the possibility again. When determining it to be possible, the wiring route searching section outputs the present layer structure to an output device. By this means, it becomes possible to estimate a layer structure and the number of layers.


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