The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 08, 2007
Filed:
Sep. 20, 2005
Porter Arbogast, Fort Collins, CO (US);
Robert L. Crane, Longmont, CO (US);
Michael P. Eland, Fort Collins, CO (US);
Steven E. Hanzlik, Fort Collins, CO (US);
Arlen L. Roesner, Fort Collins, CO (US);
Erick J. Tuttle, Fort Collins, CO (US);
Tom J. Searby, Greeley, CO (US);
Porter Arbogast, Fort Collins, CO (US);
Robert L. Crane, Longmont, CO (US);
Michael P. Eland, Fort Collins, CO (US);
Steven E. Hanzlik, Fort Collins, CO (US);
Arlen L. Roesner, Fort Collins, CO (US);
Erick J. Tuttle, Fort Collins, CO (US);
Tom J. Searby, Greeley, CO (US);
Hewlett-Packard Development Company, L.P., Houston, TX (US);
Abstract
A duct for cooling multiple components in a processor-based device. The duct has an inlet cooling duct section for a cooling airflow focused toward a processor region. The duct also has at least one exit cooling duct section for the cooling airflow extending from the inlet cooling duct section and focused toward a component region, wherein the cooling airflow is successively transportable through the processor region followed by the component region. A processor-based system having a focused cooling duct. The focused cooling duct comprises an inlet cooling duct section for a cooling airflow having a fan receptacle, and a plurality of exit cooling duct sections for the cooling airflow extending from the inlet cooling duct section and focused toward component regions, wherein the cooling airflow is successively transportable through the inlet cooling duct section followed by the plurality of exit cooling duct sections. The processor-based system also comprises a plurality of components disposed in the component regions.