The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 08, 2007

Filed:

Dec. 18, 2002
Applicants:

Bernard P. Bewlay, Schenectady, NY (US);

James A. Brewer, Scotia, NY (US);

Sylvain S. Coulombe, N—D Ile-Perrot, CA;

Sylvia M. Decarr, Schenectady, NY (US);

Luana E. Iorio, Clifton Park, NY (US);

Anteneh Kebbede, Albany, NY (US);

Timothy J. Sommerer, Ballston Spa, NY (US);

James S. Vartuli, Rexford, NY (US);

Inventors:

Bernard P. Bewlay, Schenectady, NY (US);

James A. Brewer, Scotia, NY (US);

Sylvain S. Coulombe, N—D Ile-Perrot, CA;

Sylvia M. DeCarr, Schenectady, NY (US);

Luana E. Iorio, Clifton Park, NY (US);

Anteneh Kebbede, Albany, NY (US);

Timothy J. Sommerer, Ballston Spa, NY (US);

James S. Vartuli, Rexford, NY (US);

Assignee:

General Electric Company, Niskayuna, NY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01J 17/04 (2006.01); H01J 61/04 (2006.01); H01J 5/48 (2006.01); H01J 5/50 (2006.01); H01J 9/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A hermetically sealed lamp having at least one seal-material-free bond. The seal material-free bond may be a material diffusion bond, a mechanically deformed bond such as a cold weld or crimp, a focused heat bond such as a laser bond, or any other such bond. For example, the hermetically sealed lamp may have one or more endcaps diffusion bonded to an arc envelope, such as a ceramic tube or bulb. The hermetically sealed lamp also may have one or more tubular structures, such as dosing tubes, which are mechanically closed via cold welding or crimping. Localized heating, such as the heat provided by an intense laser, also may be used to enhance any of the foregoing bonds.


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