The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 08, 2007
Filed:
Nov. 10, 2004
Yoshimi Egawa, Tokyo, JP;
Yoshimi Egawa, Tokyo, JP;
Oki Electric Industry Co., Ltd., Tokyo, JP;
Abstract
A multi chip package includes a substrate; a first semiconductor chip mounted on the substrate; a second semiconductor chip mounted above the first semiconductor chip; a first bonding wire electrically coupled to a first bonding pad on the first semiconductor chip; and a second bonding wire electrically coupled to a second bonding pad on the second semiconductor chip. At least the first bonding wire is of a coated wire, which comprises a conductive core and an outer insulation coating. At least the first bonding pad is of a multi layered pad, comprising a base pad formed on the first semiconductor chip; a first conductive layer formed on the base pad; and a second conductive layer formed on the first conductive layer.