The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 08, 2007
Filed:
Oct. 11, 2005
Chang-yong Park, Cheonan-si, KR;
Byung-man Kim, Cheonan-si, KR;
Dong-chun Lee, Cheonan-si, KR;
Yong-hyun Kim, Suwon-si, KR;
Kwang-seop Kim, Yongin-si, KR;
Dong-woo Shin, Cheonan-si, KR;
Kwang-ho Chun, Asan-si, KR;
Chang-Yong Park, Cheonan-si, KR;
Byung-Man Kim, Cheonan-si, KR;
Dong-Chun Lee, Cheonan-si, KR;
Yong-Hyun Kim, Suwon-si, KR;
Kwang-Seop Kim, Yongin-si, KR;
Dong-Woo Shin, Cheonan-si, KR;
Kwang-Ho Chun, Asan-si, KR;
Samsung Electonics Co., Ltd, Gyeonggi-do, KR;
Abstract
In one embodiment, a semiconductor module includes at least one semiconductor chip package, a board having functional pads and dummy pads, and at least one solder joint electrically connecting the semiconductor chip package and one of the functional pads of the board. Furthermore, at least one supporting solder bump is formed on one of the dummy pads and disposed under a portion of the semiconductor chip package. For example, the supporting solder bump may be disposed under a peripheral area of the semiconductor chip package.