The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 08, 2007
Filed:
Oct. 29, 2004
Applicant:
Tetsuro Nozu, Tokyo, JP;
Inventor:
Tetsuro Nozu, Tokyo, JP;
Assignee:
Kabushiki Kaisha Toshiba, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor device comprises a bonding surface to be mounted with adhesive or solder on a mounting surface of a mounting member. One or more grooves are provided on the bonding surface that extend in a direction substantially parallel to one side surface of the semiconductor device.
Nozu, Tetsuro. (2007). Semiconductor device and semiconductor apparatus (U.S. Patent No. 7215013). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7215013
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile