The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 08, 2007
Filed:
Mar. 02, 2001
Ulrich Bast, München, DE;
Georg Ernst, Thalmassing, DE;
Thomas Zeiler, Regensburg, DE;
Matthias Oechsner, Mülheim A.D. Ruhr, DE;
Ulrich Bast, München, DE;
Georg Ernst, Thalmassing, DE;
Thomas Zeiler, Regensburg, DE;
Matthias Oechsner, Mülheim A.D. Ruhr, DE;
Infineon Technologies AG, Munich, DE;
Abstract
A device for and method of packaging electronic components () using injection-molding. For this purpose, a multiplicity of components () are arranged in predetermined positions on a first side () of a leadframe (). The leadframe () has interconnects () with contact terminal areas () for connecting to contact areas () of the electronic components () and contact vias () to external contacts on a second side () of the leadframe (). In this case, the leadframe () includes a ceramic substrate () with a first side () having edge regions () configured with a ductile, annular metal layer ().