The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 08, 2007
Filed:
May. 13, 2004
Takaaki Higashida, Osaka, JP;
Kenichi Yamamoto, Osaka, JP;
Daisuke Suetsugu, Higashiosaka, JP;
Miyuki Nagaoka, Hirata, JP;
Takashi Imanaka, Kadoma, JP;
Toshinari Nitta, Kyoto, JP;
Takaaki Higashida, Osaka, JP;
Kenichi Yamamoto, Osaka, JP;
Daisuke Suetsugu, Higashiosaka, JP;
Miyuki Nagaoka, Hirata, JP;
Takashi Imanaka, Kadoma, JP;
Toshinari Nitta, Kyoto, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
A connecting structure includes a circuit board with a first connection land having a plurality of conductor patterns on the surface thereof, a second connection land disposed in a position opposite to the first connection land of the circuit board, and a flexible board including an insulating layer formed so as to surround at least a part of outer periphery of the second connection land. The first connection land and the second connection land are bonded to each other with a bonding member, and the insulating layer is thicker than the total thickness of the second connection land and the first connection land. It is possible to obtain an electronic circuit connecting structure which is free from short-circuit due to running of the bonding member such as solder even with the connecting land greatly reduced in size, and its connecting method.