The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 08, 2007
Filed:
Jan. 30, 2004
Susan Swindlehurst, Morgan Hill, CA (US);
Mark A. Hadley, Newark, CA (US);
Paul S. Drzaic, Morgan Hill, CA (US);
Gordon S. W. Craig, Palo Alto, CA (US);
Glenn Gengel, Hollister, CA (US);
Scott Hermann, Hollister, CA (US);
Aly Tootoochi, San Jose, CA (US);
Randolph W. Eisenhardt, Prunedale, CA (US);
Susan Swindlehurst, Morgan Hill, CA (US);
Mark A. Hadley, Newark, CA (US);
Paul S. Drzaic, Morgan Hill, CA (US);
Gordon S. W. Craig, Palo Alto, CA (US);
Glenn Gengel, Hollister, CA (US);
Scott Hermann, Hollister, CA (US);
Aly Tootoochi, San Jose, CA (US);
Randolph W. Eisenhardt, Prunedale, CA (US);
Alien Technology Corporation, Morgan Hill, CA (US);
Abstract
An apparatus incorporating small-feature size and large-feature-size components. The apparatus comprise a strap including a substrate with an integrated circuit contained therein. The integrated circuit coupling to a first conductor disposed on the substrate. The first conductor is made of a thermosetting or a thermoplastic material including conductive fillers. A large-scale component having a second conductor is electrically coupled to the first conductor to electrically couple the large-scale component to the integrated circuit. The large-scale component includes a second substrate.