The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 08, 2007
Filed:
Dec. 29, 2005
Naoki Ishikawa, Kawasaki, JP;
Shunji Baba, Kawasaki, JP;
Hidehiko Kira, Kawasaki, JP;
Hiroshi Kobayashi, Kawasaki, JP;
Shunichi Kikuchi, Kawasaki, JP;
Tatsuro Tsuneno, Inagi, JP;
Naoki Ishikawa, Kawasaki, JP;
Shunji Baba, Kawasaki, JP;
Hidehiko Kira, Kawasaki, JP;
Hiroshi Kobayashi, Kawasaki, JP;
Shunichi Kikuchi, Kawasaki, JP;
Tatsuro Tsuneno, Inagi, JP;
Fujitsu Limited, Kawasaki, JP;
Fujitsu Frontech Limited, Tokyo, JP;
Abstract
An IC chip mounting method which mounts two or more IC chips on a base, includes: preparing a wafer by mounting a tape on a face thereof, which is the reverse of the wafer having a mounting surface to be attached to the base, and by dividing the wafer into IC chips by dicing while leaving the tape; positioning the wafer to face the base in such a direction that the mounting surface to be attached to the base faces the base; sequentially pressing the IC chips on the wafer against the base and temporarily fixing the IC chips while the base is being fed in a prescribed one-dimensional direction along the wafer and while the wafer is being moved two-dimensionally along the base; and fixing the IC chips temporarily fixed on the base on the base by heating and pressurizing in a batch manner.