The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 08, 2007

Filed:

May. 20, 2005
Applicants:

Minehiro Tonosaki, Kanagawa, JP;

Naoki Sano, Kanagawa, JP;

Takuya Makino, Chiba, JP;

Inventors:

Minehiro Tonosaki, Kanagawa, JP;

Naoki Sano, Kanagawa, JP;

Takuya Makino, Chiba, JP;

Assignee:

Sony Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B21D 53/06 (2006.01); B21D 53/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

This invention provides a cooler having an excellent cooling performance, which is capable of being downsized and low-profiled, an electronic apparatus and a method for fabricating the cooler. The cooler () comprises lower board member () and upper complex board members. The lower board member () is made from plastic material and has a cavity portion () for allowing water or vapor to be circulated therein. The upper complex board members comprise board member () for a condenser part, upper board member (), and board member () for a wick part. The board members () and () for the condenser part and the wick part, respectively, are made from metallic material having higher thermal conductivity such as copper and nickel. Each of the members has a groove for allowing them to be served as the condenser and the wick. The upper board member () includes an opening () or () for allowing the board member () or () for the condenser part or the wick part to be incorporated, and a hollow () for heat insulation.


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