The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 08, 2007
Filed:
Dec. 14, 2004
David J. Alcoe, Vestal, NY (US);
Kim J. Blackwell, Owego, NY (US);
David J. Alcoe, Vestal, NY (US);
Kim J. Blackwell, Owego, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method and structure for forming an electronic structure that comprises a redistribution structure on a circuitized substrate. The redistribution structure includes N dielectric layers (N≧2) and N metal planes formed in the following sequence: dielectric layeron a metallic plane that exists on a surface of the substrate, metal planeon dielectric layer, dielectric layeron dielectric layerand metal plane, metal planeon the dielectric layer, . . . , dielectric layer N on dielectric layer N−1 and metal plane N−1, and metal plane N on the dielectric layer N. Metal planes or metallic planes may include signal planes, power planes, ground planes, etc. A microvia structure, which is formed through the N dielectric layers and electrically couples metal plane N to the metallic plane, includes a microvia or a portion of a microvia through each dielectric layer.