The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 08, 2007
Filed:
Mar. 31, 2004
Kiyoshi Mita, Gunma, JP;
Kiyoshi Mita, Gunma, JP;
Sanyo Electric Co., Ltd., Osaka, JP;
Kanto Sanyo Semiconductors Co., Ltd., Gunman, JP;
Abstract
Provided are a method for manufacturing a mounting substrate and a method for manufacturing a circuit device, both of which include the step of electroplating a number of electrodes. The method for manufacturing a mounting substrate includes the steps of: forming a plurality of electrodes to a mounting substrate, the plurality of electrodes being electrically connected to each other by use of plating wires; energizing the electrodes via the plating wires to coat the electrodes with plated filmsby electroplating; and electrically separating the individual electrodes from each other by cutting off the plating wires. Furthermore, the method for manufacturing a circuit device includes, in addition to the foregoing method for manufacturing a mounting substrate, the steps of: fixing a circuit element on the mounting substrate and electrically connecting the electrodes with the circuit element; and forming a sealing resin so as to cover the circuit element.