The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 01, 2007

Filed:

Feb. 09, 2004
Applicants:

Shinichi Sato, Tokyo, JP;

Hitoshi Ohkubo, Tokyo, JP;

Toshiaki Kikuchi, Tokyo, JP;

Inventors:

Shinichi Sato, Tokyo, JP;

Hitoshi Ohkubo, Tokyo, JP;

Toshiaki Kikuchi, Tokyo, JP;

Assignee:

TDK Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 5/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

Conductor layersA and insulating layersA are alternately stacked so as to prepare a base material. A plurality of grooveshaving a predetermined width are formed in a surface of the base materialin such a manner that these plural groovesare located parallel to each other along a stacking layer direction in order to form a coil inner peripheral portion. Embedding materialsare filled into the grooves. Surfacesof the base material into which the embedding materialshave been filled are flattened by polishing. The conductor layersA located adjacent to each other are connected to each other, so that helical coils which constitute inductive elements are constructed. Then, both the front plane and the rear plane of the resultant base material are covered by an insulating layer, which is cut so as to obtain respective chips.


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