The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 01, 2007

Filed:

Jan. 05, 2004
Applicants:

Shinichi Fujiwara, Yokohama, JP;

Masahide Harada, Yokohama, JP;

Kunio Matsumoto, Kosigaya, JP;

Eiji Matsuzaki, Yokohama, JP;

Inventors:

Shinichi Fujiwara, Yokohama, JP;

Masahide Harada, Yokohama, JP;

Kunio Matsumoto, Kosigaya, JP;

Eiji Matsuzaki, Yokohama, JP;

Assignees:

Hitachi, Ltd., Tokyo, JP;

Hitachi Media Electronics Co., Ltd., Mizusawa-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 41/08 (2006.01);
U.S. Cl.
CPC ...
Abstract

An electronic device of a chip size having improved airtightness is designed to be formed by a reduced number of process steps. An electronic component including a chip having a functional surface and electrodes at least on one side and a substrate having a portion which can be connected to the electrodes of the chip is designed as such an electronic device. In the electronic component, electroconductive glass or an intermetallic compound is used for connection portions to establish electrical connections between the chip and the substrate and to simultaneously seal the device surface on the chip.


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