The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 01, 2007
Filed:
Jan. 28, 2002
Dion F. Davis, Palmdale, CA (US);
Gabriel A. Mouchawar, Valencia, CA (US);
Alvin H. Weinberg, Moorpark, CA (US);
Dion F. Davis, Palmdale, CA (US);
Gabriel A. Mouchawar, Valencia, CA (US);
Alvin H. Weinberg, Moorpark, CA (US);
Pacesetter, Inc., Sylmar, CA (US);
Abstract
A high density electronic circuit for use in an implantable stimulation device that comprises a flexible substrate that has the advantage of integrating 'chip-and-wire' microelectronic circuits and flexible interconnections that are adapted to conform to the body compatible housing into a single structure. The flexible substrate has die attach pads, each die attach pad having a set of wire bond pads therearound, each wire bond pad being connected to conductors formed within the substrate according to circuit function. A plurality of chip-and-wire integrated circuit (IC) chips are mounted by epoxy die attachment on the die attach pads, each IC chip has a plurality of contact pads formed on a top surface thereof, and gold wire bonds electrically connect the plurality of contact pads to the wire bonds pads. The wire bonds include a primary bond and, optionally, a safety bond for reinforcement. Other techniques are disclosed to enable the use of the gold wire bonds on a flexible substrate.