The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 01, 2007

Filed:

Mar. 22, 2005
Applicants:

Bily Wang, Hsin Chu, TW;

Jonnie Chuang, Pan Chiao, TW;

Heng-yen Lee, Hsin Chu Hsien, TW;

Hui-yen Huang, Hsin Chu, TW;

Inventors:

Bily Wang, Hsin Chu, TW;

Jonnie Chuang, Pan Chiao, TW;

Heng-Yen Lee, Hsin Chu Hsien, TW;

Hui-Yen Huang, Hsin Chu, TW;

Assignee:

Harvatek Corporation, Hsin Chu, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

An LED package structure and a method for making the same are described. The LED package structure has at least one LED die, at least one metallic frame relating to the LED die, and an insulative body packaging the LED die and the metallic frame. The metallic frame has a first contact corresponding to the LED die and a second contact being relative to the first contact. The first and the second contacts inside the insulative body are electrically isolated from each other. The first contact has at least one recess around the LED die, and the second contact has at least one groove formed thereon.


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