The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 01, 2007
Filed:
Jul. 05, 2005
Michael Cave, Pflugerville, TX (US);
Michael May, Austin, TX (US);
Mathew Rybicki, Austin, TX (US);
Timothy Markison, Austin, TX (US);
Michael Cave, Pflugerville, TX (US);
Michael May, Austin, TX (US);
Mathew Rybicki, Austin, TX (US);
Timothy Markison, Austin, TX (US);
ViXS Systems, Inc., Toronto, Ontario, CA;
Abstract
A method of manufacturing a high frequency integrated circuit begins by positioning a die within a package, wherein the die includes a circuit that processes a high frequency signal and at least one bond pad operably coupled to the circuit, and wherein the package includes a plurality of bond posts, wherein at least one of the plurality of bond posts is allocated to the at least one bond pad. The method continues by bonding a first plate of a capacitor to the at least one bond pad. The method continues by bonding a second plate of the capacitor to the at one of the plurality of bond posts.