The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 01, 2007
Filed:
May. 13, 2004
Yukihiro Yanagawa, Kashima-gun, JP;
Takumi Yagi, Kashima-gun, JP;
Masaru Karai, Kashima-gun, JP;
Kuraray Co., Ltd., Kurashiki-shi, JP;
Abstract
The present invention is to provide a resin-forming mold having high releasability and permitting a production without increasing production costs. The resin-forming mold can be used to produce a resin-molded product having minute uneven portions on a front face thereof, such as a surface light source device-use light guide for a liquid crystal display, an aspherical micro-lens, micro-Fresnel lens and an optical disk. In the stamper (resin-forming mold)provided with an electroformed layerand a conductive filmformed on the electroformed layer, the front face layerof the conductive filmis formed of aluminum and a back faceis formed of nickel as an electroconductive metal. In addition, the constituent composition of the aluminum and the nickel continuously changes from the front facetoward the back face. The front facemay be formed of aluminum and oxygen. The aluminum may combine with the oxygen to form an oxide of aluminum.