The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 01, 2007

Filed:

Aug. 28, 2003
Applicant:

Kyoichi Iwata, Toyokawa, JP;

Inventor:

Kyoichi Iwata, Toyokawa, JP;

Assignee:

Sintokogio, Ltd., Aichi-Ken, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 19/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method and a device for easily setting a processing condition from a dent rate of a product by giving an arbitrary dent producing condition and a shotblast processing condition in a shotblasting process. The method calculates a processing time, a projection amount and a projection material speed for enabling a target dent rate to be set, from the number of dents in a predetermined dent unit area and time. The method comprises the steps of: calculating a dent unit area from a projection material hardness, a projection material particle size, a projection material speed and the hardness of a processed product; calculating the number of dents required to attain a predetermined target dent rate; and calculating a processing time from the number of dents, a projection amount, a projection material density and the projection material particle size.


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