The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 24, 2007
Filed:
Mar. 02, 2005
Michio Miura, Kawasaki, JP;
Masanori Ueda, Yokohama, JP;
Shunichi Aikawa, Sannohe, JP;
Toru Uemura, Sannohe, JP;
Kunihisa Wada, Sannohe, JP;
Naoyuki Mishima, Yokohama, JP;
Michio Miura, Kawasaki, JP;
Masanori Ueda, Yokohama, JP;
Shunichi Aikawa, Sannohe, JP;
Toru Uemura, Sannohe, JP;
Kunihisa Wada, Sannohe, JP;
Naoyuki Mishima, Yokohama, JP;
Fujitsu Media Devices Limited, Yokohama, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
A bonded substrate includes a lithium tantalate substrate and a sapphire substrate to which the lithium tantalate substrate is bonded, a bonded interface of the lithium tantalate and the sapphire substrate includes a bonded region in an amorphous state having a thickness of 0.3 nm to 2.5 nm. The bonded region in the amorphous state is formed by activating at least one of the lithium tantalate substrate and the sapphire substrate in the bonded interface with neutralized atom beams, ion beams or plasma of inert gas or oxygen. It is possible to bond the piezoelectric substrate to the supporting substrate having different lattice constants without the high-temperature thermal treatment and realize the bonded substrate having an excellent bonding strength and being less warped.