The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 24, 2007
Filed:
Jul. 20, 2004
Leeshawn Luo, Santa Clara, CA (US);
Anup Bhalla, Santa Clara, CA (US);
Sik K. Lui, Sunnyvale, CA (US);
Yueh-se Ho, Sunnyvale, CA (US);
Mike F. Chang, Cupertino, CA (US);
Xiao Tian Zhang, San Jose, CA (US);
Leeshawn Luo, Santa Clara, CA (US);
Anup Bhalla, Santa Clara, CA (US);
Sik K. Lui, Sunnyvale, CA (US);
Yueh-Se Ho, Sunnyvale, CA (US);
Mike F. Chang, Cupertino, CA (US);
Xiao Tian Zhang, San Jose, CA (US);
Alpha and Omega Semiconductor Ltd., Hamilton, BM;
Abstract
A semiconductor package including a relatively thick lead frame having a plurality of leads and a first lead frame pad, the first lead frame pad including a die coupled thereto, bonding wires connecting the die to the plurality of leads, the bonding wires being aluminum, and a resin body encapsulating the die, bonding wires and at least a portion of the lead frame.