The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 24, 2007
Filed:
Sep. 15, 2004
Applicants:
Yukio Komatsu, Kanagawa-ken, JP;
Hajime Koyama, Kanagawa-ken, JP;
Inventors:
Yukio Komatsu, Kanagawa-ken, JP;
Hajime Koyama, Kanagawa-ken, JP;
Assignee:
Kabushiki Kaisha Toshiba, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/73 (2006.01); H01L 29/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor device which includes fuses for relieving defective areas in the semiconductor device is described. There is provided a semiconductor device including a semiconductor substrate having a circuit element, an insulating layer provided on the semiconductor substrate, a fuse element formed in the insulating layer, the fuse element including at least two fuse units connected in series, each of the fuse units having a resistor and a fuse connected in parallel, the fuse disposed above the resistor.