The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 24, 2007

Filed:

Mar. 25, 2002
Applicants:

Yoshihiko Teramoto, Tsuruga, JP;

Seiji Watanuki, Otsu, JP;

Hiroki Murase, Otsu, JP;

Inventors:

Yoshihiko Teramoto, Tsuruga, JP;

Seiji Watanuki, Otsu, JP;

Hiroki Murase, Otsu, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 67/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of preparing a precursor for a composite having wet strength of 2 to 50 kgf/mmand a mean surface void diameter of 0.01 to 2 μm by molding a solution of a rigid polymer having a concentration of 1 to 1.3 times the optical anisotropy lower limit solution concentration C2, thereafter rendering the solution non-flowable by absorbing a coagulant under a condition causing no solvent extraction and thereafter extracting the solvent, and a method of preparing a molecular composite having a mean thickness of 2 to 200 μm by impregnating this precursor for a composite with a solution of a polymer or reactive molecules.


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