The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 24, 2007
Filed:
Jun. 21, 2004
Seung-joo Shin, Seoul, KR;
Yong-soo OH, Seongnam-si, KR;
Su-ho Shin, Suwon-si, KR;
Min-soo Kim, Seoul, KR;
Hyung-taek Lim, Seoul, KR;
Chang-seung Lee, Seongnam-si, KR;
You-seop Lee, Yongin-si, KR;
Keon Kuk, Yongin-si, KR;
Seung-joo Shin, Seoul, KR;
Yong-soo Oh, Seongnam-si, KR;
Su-ho Shin, Suwon-si, KR;
Min-soo Kim, Seoul, KR;
Hyung-taek Lim, Seoul, KR;
Chang-seung Lee, Seongnam-si, KR;
You-seop Lee, Yongin-si, KR;
Keon Kuk, Yongin-si, KR;
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Abstract
An ink-jet printhead includes a substrate having an ink chamber and a manifold, a nozzle plate formed on the substrate, first and second heaters and conductors, a material layer, and a plurality of ink channels. The nozzle plate includes a plurality of passivation layers formed of an insulating material, a heat dissipation layer formed on the plurality of passivation layers and made of a thermally conductive material, and a nozzle passing through the nozzle plate and in flow communication with the ink chamber. The first and second heaters and conductors are interposed between adjacent passivation layers of the nozzle plate. The material layer is interposed between the ink chamber and the manifold to form a bottom wall of the ink chamber and a top wall of the manifold. The plurality of ink channels is formed in the material layer to provide flow communication between the ink chamber and the manifold.