The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 17, 2007
Filed:
Mar. 23, 2005
M. Ray Fairchild, Kokomo, IN (US);
Dwadasi H. R. Sarma, Kokomo, IN (US);
Derek B. Workman, Noblesville, IN (US);
Daniel R. Harshbarger, Kokomo, IN (US);
M. Ray Fairchild, Kokomo, IN (US);
Dwadasi H. R. Sarma, Kokomo, IN (US);
Derek B. Workman, Noblesville, IN (US);
Daniel R. Harshbarger, Kokomo, IN (US);
Delphi Technologies, Inc, Troy, MI (US);
Abstract
An electronic assembly includes a first substrate and a second substrate. The first substrate includes a first surface having a first plurality of conductive traces formed on an electrically non-conductive layer. The second substrate includes a first surface having a second plurality of conductive traces formed thereon and a second surface having a third plurality of conductive traces formed thereon. A first electronic component is electrically coupled to one or more of the plurality of conductive traces on the first surface of the second substrate. At least one of a plurality of conductive interconnects is incorporated within each solder joint that electrically couples one or more of the conductive traces formed on the second surface of the second substrate to one or more of the conductive traces formed on the first substrate.