The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 17, 2007
Filed:
Aug. 11, 2004
Applicants:
Osamu Nakamura, Kodaira, JP;
Keishi Takeyama, Hamura, JP;
Tsutomu Terazaki, Fussa, JP;
Inventors:
Assignee:
Casio Computer Co., Ltd., Tokyo, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 31/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A junction substrate includes a first substrate, a buffer film formed on one surface of the first substrate, a metal containing film formed on the buffer film and having a lower resistance than the buffer film, and a second substrate bonded to the other surface of the first substrate.
Nakamura, Osamu. (2007). Junction substrate and method of bonding substrates together (U.S. Patent No. 7205625). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7205625
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