The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 17, 2007
Filed:
Feb. 15, 2001
Dominik Eisert, Regensburg, DE;
Volker Härle, Laaber, DE;
Frank Kühn, München, DE;
Manfred Mundbrod-vangerow, Oxenbronn, DE;
Uwe Strauss, Bad Abbach, DE;
Jacob Ulrich, Regensburg, DE;
Ernst Nirschl, Wenzenbach, DE;
Norbert Linder, Wenzenbach, DE;
Reinhard Sedlmeier, Neutraubling, DE;
Ulrich Zehnder, Regensburg, DE;
Johannes Baur, Deuerling, DE;
Dominik Eisert, Regensburg, DE;
Volker Härle, Laaber, DE;
Frank Kühn, München, DE;
Manfred Mundbrod-Vangerow, Oxenbronn, DE;
Uwe Strauss, Bad Abbach, DE;
Jacob Ulrich, Regensburg, DE;
Ernst Nirschl, Wenzenbach, DE;
Norbert Linder, Wenzenbach, DE;
Reinhard Sedlmeier, Neutraubling, DE;
Ulrich Zehnder, Regensburg, DE;
Johannes Baur, Deuerling, DE;
Osram GmbH, , DE;
Abstract
This invention describes a radiation-emitting semiconductor component with the a multilayered structure () that contains a radiation-emitting active layer (), and a window () transparent to radiation that has a first principal face () and a second principal face () opposite the first principal face (), and whose first principal face () adjoins the multilayered structure (). At least one recess () is made in the window (), which preferably has the form of an indentation of the second principal face or as an edge excavation. At least one lateral surface of the window () or of the recess () is provided at least partially with a contact surface (). Alternatively or cumulatively, at least one contact surface of the component has a plurality of openings ().