The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 17, 2007

Filed:

Aug. 24, 2004
Applicants:

LI Chong Tai, Penang, MY;

Angeline Khoo, Penang, ML;

Ban Kuan Koay, Penang, ML;

Inventors:

Li Chong Tai, Penang, MY;

Angeline Khoo, Penang, ML;

Ban Kuan Koay, Penang, ML;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/14 (2006.01);
U.S. Cl.
CPC ...
Abstract

A compact optical sensor package for use in an optical mouse. The optical sensor package includes a chip enclosure which is physically and electrically bonded to a main circuit Board using Ball Grid Array (BGA) technology. The chip enclosure includes a windowed cover having a window, and a base board hermetically sealed to the windowed cover to enclose the sensor chip. The sensor chip is electrically connected to bonding pads on the inner surface of the base plate. The bonding pads are electrically connected through the base plate to bonding pads on the outer surface of the base plate. The bonding pads on the outer surface of the base plate are elements in this application of Ball Grid Array technology.


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