The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 17, 2007
Filed:
Jun. 30, 2005
Walter DE Raedt, Lint, BE;
Steven Brebels, Hechtel-Ekstel, BE;
Steven Sanders, Roeselare, BE;
Tom Torfs, Leuven, BE;
Eric Beyne, Leuven, BE;
Walter De Raedt, Lint, BE;
Steven Brebels, Hechtel-Ekstel, BE;
Steven Sanders, Roeselare, BE;
Tom Torfs, Leuven, BE;
Eric Beyne, Leuven, BE;
Abstract
A method of bonding two elements such as wafers used in microelectronics applications is disclosed. One inventive aspect relates to a method for bonding comprising producing on a first main surface of a first element a first solder ball, producing on a first main surface of a second element a second solder ball, providing contact between the first solder ball and the second solder ball, bonding the first element and the second element by applying a reflow act whereby the solder balls melt and form a joined solder ball structure. Prior to the bonding, the first solder ball is laterally embedded in a nonconductive material, such that the upper part of the first solder ball is not covered by the non-conductive material. Devices related to such methods are also disclosed.