The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 17, 2007

Filed:

Mar. 16, 2006
Applicants:

Seiichiro Sato, Kawasaki, JP;

Kenji Tsutsumi, Kawasaki, JP;

Hiroshi Takawa, Kawasaki, JP;

Kenji Toshimitsu, Kawasaki, JP;

Takashi Inoue, Kawasaki, JP;

Inventors:

Seiichiro Sato, Kawasaki, JP;

Kenji Tsutsumi, Kawasaki, JP;

Hiroshi Takawa, Kawasaki, JP;

Kenji Toshimitsu, Kawasaki, JP;

Takashi Inoue, Kawasaki, JP;

Assignee:

Fujitsu Limited, Kawasaki, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 13/62 (2006.01);
U.S. Cl.
CPC ...
Abstract

An SFP module mounting structure whereby the region of a printed wiring board for mounting SFP modules is enlarged and thus the SFP modules can be mounted with high density. A swing mechanism constituted by the coupling between a holder and a base allows the holder to be swung in directions toward and away from the printed wiring board. Thus, when mounting an SFP module, the SFP module can be inserted into the holder with the holder kept in an obliquely raised state relative to the printed wiring board. Also, when detaching the SFP module, the SFP module can be pulled out of the holder with the holder obliquely raised from the printed wiring board.


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