The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 10, 2007

Filed:

Jul. 15, 2003
Applicants:

Thomas Wiegele, Apple Valley, MN (US);

Christopher Apanius, Moreland Hills, OH (US);

Kenneth G. Goldman, Olmsted Township, OH (US);

Shuwen Guo, Lakeville, MN (US);

Loren E. St. Clair, Apple Valley, MN (US);

Timothy R. O'meara, Burnsville, MN (US);

James J. Pohl, Apple Valley, MN (US);

Inventors:

Thomas Wiegele, Apple Valley, MN (US);

Christopher Apanius, Moreland Hills, OH (US);

Kenneth G. Goldman, Olmsted Township, OH (US);

Shuwen Guo, Lakeville, MN (US);

Loren E. St. Clair, Apple Valley, MN (US);

Timothy R. O'Meara, Burnsville, MN (US);

James J. Pohl, Apple Valley, MN (US);

Assignee:

Rosemount Aerospace Inc., Burnsville, MN (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02B 6/26 (2006.01);
U.S. Cl.
CPC ...
Abstract

A micro mirror array including an upper wafer portion having a plurality of movable reflective surfaces located thereon, the upper wafer portion defining a coverage area in top view. The array further includes a lower wafer portion located generally below and coupled to the upper wafer portion. The lower wafer portion includes at least one connection site located thereon, the at least one connection site being electrically or operatively coupled to at least one component which can control the movement of at least one of the reflective surfaces. The at least one connection site is not generally located within the coverage area of the upper wafer portion.


Find Patent Forward Citations

Loading…