The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 10, 2007
Filed:
Aug. 16, 2004
Brian D. Thompson, Kokomo, IN (US);
Charles I. Delheimer, Noblesville, IN (US);
Derek B. Workman, Noblesville, IN (US);
Jeenhuei S. Tsai, Carmel, IN (US);
Matthew R. Walsh, Sharpsville, IN (US);
Scott D. Brandenburg, Kokomo, IN (US);
Brian D. Thompson, Kokomo, IN (US);
Charles I. Delheimer, Noblesville, IN (US);
Derek B. Workman, Noblesville, IN (US);
Jeenhuei S. Tsai, Carmel, IN (US);
Matthew R. Walsh, Sharpsville, IN (US);
Scott D. Brandenburg, Kokomo, IN (US);
Delphi Technologies, Inc., Troy, MI (US);
Abstract
An electronic module includes a substrate, at least one surface mounted integrated circuit (IC) component and an underfill material. The substrate includes a plurality of electrically conductive traces, formed on at least one surface of the substrate, and the component is electrically coupled to at least one of the conductive traces. The underfill material is positioned between the component and the substrate and provides at least one pedestal that supports the component during encapsulation. The underfill material, when cured, maintains the integrity of the electrical connections between the component and the conductive traces.