The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 10, 2007
Filed:
Dec. 17, 2003
Hojun Yoon, Stevenson Ranch, CA (US);
Richard King, Thousand Oaks, CA (US);
Jerry R. Kukulka, Santa Clarita, CA (US);
James H. Ermer, Burbank, CA (US);
Maggy L. Lau, Hacienda Heights, CA (US);
Hojun Yoon, Stevenson Ranch, CA (US);
Richard King, Thousand Oaks, CA (US);
Jerry R. Kukulka, Santa Clarita, CA (US);
James H. Ermer, Burbank, CA (US);
Maggy L. Lau, Hacienda Heights, CA (US);
The Boeing Company, Chicago, IL (US);
Abstract
A semiconductor structure includes a semiconductor substrate, a semiconductor active region, a semiconductor contact layer, at least one metal migration semiconductor barrier layer, and a metal contact. The metal migration semiconductor barrier layer may be embedded within the semiconductor contact layer. Furthermore, the metal migration semiconductor barrier layer may be located underneath or above and in intimate contact with the semiconductor contact layer. The metal migration semiconductor barrier layer and the semiconductor contact layer form a contact structure that prevents metals from migrating from the metal contact into the semiconductor active layer during long-term exposure to high temperatures. By providing a robust contact structure that may be used in semiconductor structures, for example in solar cells that power spacecraft or terrestrial solar cells used under concentrated sunlight, the high temperature reliability of the semiconductor structure will be improved and the operation time will be prolonged.