The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 10, 2007
Filed:
Aug. 06, 2003
Masanori Onodera, Kawasaki, JP;
Susumu Moriya, Kawasaki, JP;
Izumi Kobayashi, Kawasaki, JP;
Hiroshi Aoki, Kawasaki, JP;
Toshiyuki Honda, Kawasaki, JP;
Masanori Onodera, Kawasaki, JP;
Susumu Moriya, Kawasaki, JP;
Izumi Kobayashi, Kawasaki, JP;
Hiroshi Aoki, Kawasaki, JP;
Toshiyuki Honda, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
In a camera module of a so-called multi-chip type, an imaging device and a semiconductor element for processing are mounted. The semiconductor element is encapsulated by a mold resin. Protruding parts are formed by the mold resin on a mounting surface of the mold resin. A metal film forming a pattern wiring is formed on the mounting surface of the mold resin. The metal film is also formed on the protruding parts so as to constitute external connection terminals together with the protruding parts. Electrodes of the semiconductor element are electrically connected to the pattern wiring. The protruding parts include first protruding parts positioned around the semiconductor element and second protruding parts formed in a mounting area of the semiconductor element on the mounting surface.