The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 10, 2007

Filed:

May. 20, 2004
Applicants:

Philippe Delpech, Meylan, FR;

Christophe Regnier, St. Hilaire du Touvet, FR;

Sebastien Cremer, Grenoble, FR;

Stephane Monfray, Grenoble, FR;

Inventors:

Philippe Delpech, Meylan, FR;

Christophe Regnier, St. Hilaire du Touvet, FR;

Sebastien Cremer, Grenoble, FR;

Stephane Monfray, Grenoble, FR;

Assignee:

STMicroelectronics SA, Montrouge, FR;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/20 (2006.01);
U.S. Cl.
CPC ...
Abstract

A process for producing an integrated electronic circuit. The process begins with the production of a first electronic component and a second electronic component that are superposed on top of a substrate. A volume of temporary material is formed on the substrate at the position of the second electronic component. The first electronic component is then produced above the volume of temporary material relative to the substrate, and then the second electronic component is produced using at least one shaft for access to the temporary material. The first electronic component may be an active component and the second electronic component may be a passive component.


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